AEGIS Software GmbH
Speaker: Dr.-Ing. Friedrich W. Nolting, shareholer AEGIS Software GmbH
Dr.-Ing. Friedrich W. Nolting is shareholder of Aegis Software GmbH in Erlangen. He achieved interbranch recognition by numerous developments for the Electronic Industry. Today his concepts and designs for e.g. setup optimizations by using the cluster method or the dynamic recipe optimization for LED binning are used by many vendors.
Alpha Assembly Solutions
Maximise Printing Results and Minimise Defects with the Zero Defect Strategy
The Zero Defect Strategy starts with the paste printing process which is responsible for 60% of all defects. Yield prediction and control of the process variation is crucial to maximising the printing result and minimising the defects. This can be achieved with the use of solder paste printing stencils, which enable optimal control of paste deposits, and by understanding paste behaviour.
Speaker: Corné Hoppenbrouwers, Technical Support for Central Europe Alpha Assembly Solutions
As Technical Support Manager for Alpha in Central Europe Corné Hoppenbrouwers provides technical support to Alpha customers in Germany, Austria and Switzerland. Corné has worked for Alpha for 21 years, previous to this he held positions with Fokker ELMO, Difa and Ecrisson in Holland.
New HighTech Materials for Stencil Printing
The precision stencil is the tool of choice for defining the print deposits in a wide variety of printing processes employed in the electronics industry. Since laser cutting machines were introduced, stainless steel has been the preferred raw material used for these stencils. For decades, the utilised stainless steel has not been changed, only the plates made from it have become increasingly thinner. With the arrival of Ultra Finepitch components (e.g. 0201, 01005 and µBGA) and new printing media, the conventional raw material has reached its limits and new materials for manufacturing the stencil had to be found.
The lecture looks at the requirements that the raw material of the stencil must meet today. In this context, the manufacture, processing and also the impact on the print quality are examined in depth. A wide variety of stainless steel and nickel materials are discussed. It will be pointed out which raw materials should be considered for which printing requirements.
Speaker: Michael Zahn, works for Christian Koenen GmbH in the function of Global Business Development Manager
Michael Zahn was born in 1968 in Hadamar (Hesse, Germany). After finishing high school, he initially completed an apprenticeship in metalworking technology. In 1998, he earned a Bachelor’s degree in Metal Production Technology & Operations CCI, and in 2001, he completed his studies in Wetzlar with a Master’s Degree in Technical Management CCI (Master of Business Administration). From 1994 to 2001, Mr Zahn was employed as Production Manager at Mania GmbH, a printed circuit board testing company. In 2001, he moved to ASM Assembly Systems (formerly DEK International) where he successively held the positions of Operations Manager for Germany, Operations Manager for Europe, Global Product & Franchise Manager and finally Business Manager for Electroform in Asia. In the course of his professional career, Michael Zahn has gained extensive experience in the areas product development, operations and (strategic) management. Thanks to his innovation-focussed work as product and process developer for the SMT, LED and solar industries, Michael Zahn has made a name for himself contributing to the patenting of a large number of products, e. g. printing of LED converters and printing of metallization on solar wafers. On 1 June 2016, Michael Zahn joined the team of Christian Koenen GmbH. His areas of responsibility include: Development of new printing technologies and the coordination of the establishment of the plant in Györ.
Zero Defect in soldering technology and paste printing
Increasing digital networks in both private and industrial environments, including automobile industry and E-mobility will significantly drive the electronics industry. Equipment manufacturers and EMS companies face an enormous cost pressure in the production of electronic assemblies. Manufacturers of production equipment respond with ever more sophisticated “zero-defect-strategies”. One buzzword in this connection is intelligent sensor technology. We will explain zero defect concepts in soldering technology and solder paste printing.
Speaker: Dipl.-Ing.(FH) Jürgen Friedrich, Head of Application Technology
Jürgen Friedrich is Head of Application Technology and cooperates closely with customers and scientific institutions worldwide. Trainings on soldering technology as well as presentations and seminars at international events round off his field of work. Mr. Friedrich is certified trainer IPC-A-610 and CIS for the IPC-7711/7721B, and he manages the certified Ersa training center, which offers personnel training and education courses.
Clever & Smart
Efficient module combinations for your demanding soldering applications
Speaker: Matthias Fehrenbach, Managing Board EUTECT
Matthias Fehrenbach is member of the Eutect managing board since 2010. As a qualified mechatronic engineer he also completed his degree in business administration, industrial engineering and international business management.
Fuji Machine MFG.(Europe) GmbH
Speaker: Jonas Ernst, Area Sales Manager Fuji Machine MFG.(Europe) GmbH
Eng. Jonas Ernst (year 1986) is Sales Engineer and expert for set up concepts within the Fuji Team. After the study of electrical engineering, he works as a Technical Sales for active Parts like microcontroller. Withfour yearsFujiaffiliationstill relatively newin the industry, he is responsible forcompletelyWestGermanyas well askey accountsin theEMSandsemiconductorsector.
Speaker: Andreas Karch, Regional Technical Manager Germany-Austria-Switzerland Indium Corporation
Andreas provides support, including sharing process knowledge and making technical recommendations for the use of Indium Corporation’s materials, including solder paste, solder preforms, fluxes, and thermal management materials.
Andreas has more than 20 years of automotive industry experience in PCB assembly and power electronics, including the advanced development of customized electronics. The Austrian Patent Office also selected him as one of the 2014 recipients of the Top 10 Inventum Awards for an automotive LED assembly. Andreas is an ECQA-certified integrated design engineer and earned his Six Sigma Yellow Belt. His thorough understanding of process technologies and project management skills reinforces Indium Corporation’s commitment to providing world-class service to our customers in Europe.
Koh Young Europe GmbH
Speaker: Harald Eppinger, General Manager/European Sales Manager Koh Young Europe GmbH
Harald Eppinger worked with KYE’s European distributors as they serve Koh Young’s valued customers in the territory. Harald Eppinger is responsible for managing key global accounts, training, and implementing individually-designed solutions for customers’ inspection and process optimization requirements.
Over 20 years of experience in the sales, he is an industry veteran of not only Automatic Optical Inspection (AOI) and Solder Paste Inspection (SPI) but also total production solution.
LPKF Laser & Electronics AG
Precision PCB-Depaneling using UV-Laser Technology
Elimination of failure: thermal/ mechanical stress
debris and chippings Advantages: Design Freedom; Circuit Density
Speaker: Florian Roick, Product Manager LPKF
Born in 1981. Master of Science. Post-graduate study in electrical engineering with main focus on laser systems and laser physics. Since 2006 employed at LPKF Laser & Electronics AG, until 2008 as product manager StencilLaser, since 2015 as strategic product manager responsible for aligning the product portfolio with the needs and requirements of the PCB and SMT markets. Co-inventor of the parametric Stick-in and co-author of a variety of publications.
Zero-Fault Production in Soldering Processes: Quality Management Based on Quality Assurance
Automated process control and integrated rework of assemblies enable the completely documented zero-fault production in soldering processes.
Speaker: Kevin Wendt , research and development SEHO
Optical 3D quality control – the “missing link” of zero-defect production. 100% inspection / verification – is it possible?
The dimensional accuracy of assembled components is highly relevant to product quality. Thanks to high-precision optical 3D measurement technology expenditure time is reduced all the while sample sizes can be significantly increased.
Speaker: Martin Scheer, Area Sales Manager at smartTec GmbH
Mr. Martin Scheer, Area Sales Manager at smarTec GmbH for industrial goods in Baden-Württemberg and Switzerland has some 15 years of experience and gained competent knowledge in the field of electronic manufacturing.
Competitive strength through intelligent inspection concepts
During development, electronics designers must rely on their experience. Not only do automatic inspection systems reliably detect defects, they also deliver essential quality indicators and microscopic images of faulty layouts. This makes an important contribution to future avoidance of defect causes due to design.
Speaker: Michael Mügge, Sales Engineer VISCOM
Michael Mügge has been employed as Sales Engineer at Viscom AG since 2005. His professional career started with education as radio electronics technician at Fuba and continued with studies in electrical engineering at the Hanover University of Applied Sciences. He then undertook an eight-year occupation in Manufacturing Engineering, with a concentration in SMT production, at what later became Delphi Automotive GmbH. Five years before changing to Viscom, Mr. Mügge began occupation with the Bosch Group as production planner with a focus on electronics assembly. In addition to his presence in Sales, since 2013 Michael Mügge has been deputy head of the Professional Association of Electronics Designs (FED) regional group in Hanover, Germany.
Technical cleanliness and purity in the PCBA production as element of a 100% quality principle
The lecture gives an overview about the risk of particles on PCBAs, the measurement of particles, existing standards as well as possible ways for the reduction of particles in production.
Speaker: Stefan Strixner, Principal Engineer ZESTRON
Stefan Strixner studied Chemical Technology and has been assisting ZESTRON since the company was founded. Among other things, he advises and supports the international sales partners as well as customers from Europe and Asia. He was co-responsible for setting up the technical centres at the global locations of ZESTRON and took charge here of the on-site induction and training of the employees with posts of responsibility at those locations.